What We Do
NEXOSAT SEMICON focuses on developing comprehensive semiconductor backend manufacturing capabilities across the entire packaging value chain.
Advanced Packaging Technologies
- Fan-Out Wafer-Level Packaging (FOWLP)
- System-in-Package (SiP)
- Wafer-Level Packaging (WLP)
- Flip-Chip Packaging
2.5D/3D Packaging & Chiplet Integration
- Interposer-based Packaging
- Through-Silicon Via (TSV)
- Chiplet Architectures
- Heterogeneous Integratiosn
